Oxford Nanopore Releases Sequencing Kit Updates as Applied Materials Adds Nano Tool Features

Nanotechnology vendors roll out early-2026 product and feature updates across genomics, chipmaking, and printed electronics. Oxford Nanopore details sequencing kit improvements while Applied Materials, Lam Research, Nano Dimension, and Nanoscribe introduce tool and software enhancements.

Published: January 11, 2026 By David Kim Category: Nanotechnology
Oxford Nanopore Releases Sequencing Kit Updates as Applied Materials Adds Nano Tool Features

Executive Summary

  • Oxford Nanopore releases sequencing kit and flow cell updates, targeting higher duplex accuracy and throughput, as outlined this week on its product update pages.
  • Applied Materials and Lam Research introduce incremental nano-manufacturing tool features aimed at tighter process control for advanced nodes, based on recent company announcements and technical notes.
  • Nano Dimension pushes a firmware update for its DragonFly system to improve sub-10 micrometer trace fidelity and speed, according to its product release communications.
  • Nanoscribe rolls out a software feature update for two-photon polymerization systems to streamline micro- and nano-scale 3D print workflows, per its product documentation.

Launches in Nanomanufacturing and Genomics

Oxford Nanopore Technologies has released early-2026 sequencing kit and flow cell updates designed to improve duplex read performance and downstream variant calling accuracy, with company materials pointing to iterative gains in yield and consensus quality in the latest chemistry and software combinations (Oxford Nanopore). The company’s update cadence aligns with ongoing documentation showing optimization of pore design, membranes, and basecalling models across PromethIon and MinION platforms (Oxford Nanopore product news), and builds on recent kit revisions noted in its technical bulletins (Oxford Nanopore technical updates).

In semiconductor nanofabrication, Applied Materials has detailed new metrology and patterning software features for its platforms that focus on across-wafer uniformity and critical dimension variability at advanced geometries, with recent technical notes emphasizing process window widening and feed-forward control enhancements (Applied Materials newsroom). Company briefings continue to reference pattern-shaping and film engineering updates that are applicable to logic and memory process modules spanning etch, deposition, and inspection (Applied Materials), with feature additions framed as incremental rather than wholesale platform changes.

Incremental Tool Features from Equipment Vendors

Lam Research has outlined feature extensions to select atomic layer deposition and etch modules that target defect reduction and improved aspect ratio coverage for nanoscale features, noting software recipe refinements and chamber condition monitoring to stabilize performance across lots (Lam Research newsroom...

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